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Topic: CAD


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Nano Dimension Introduces DragonFly LDM for Continuous Digital Manufacturing of Electronics
HENSOLDT tests the DragonFly LDM additive manufacturing technology and discusses the results.

Volkswagen updates classic van with generative design, RoboCup flexes autonomous muscles, more
In this episode of DE Video News roundup, VW uses Autodesk Fusion to reshape Microbus, autonomous robots play soccer, Onshape study finds PLM insights, more

Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production
Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.

NAND Flash Finds a Home in the IoT
Advances in the technology now let NAND flash memory offer faster throughput, greater flexibility and better price points per byte, opening the door for its use as primary storage.

HxGN 2019 where AR/VR meets Metrology; Epson Releases Augmented Reality Remote Assist
Hexagon's HxGN highlights intersection of AR/VR and metrology; Epson launches AR-based remote assistance app.

Siemens Adds Augmented Reality for Enhanced Visualization and Collaboration to Solid Edge 2020
New simulation validation capabilities help to improve quality and reduce costly prototypes, company says.

Researchers in Denmark Apply AI to Autonomous Drones
The AiR Lab designs and prints its own drone prototypes while developing hybrid controllers.

Artec 3D Releases Artec Studio 14 with Functionality for Quality Inspection
New features include integration with metrology-grade desktop 3D scanner Artec Micro, target-free registration for 3D laser scanner Artec Ray, and Direct Export for CAD/CAM, Automatic Glare Removal.

Rand 3D Brings Training Solutions to PTC LiveWorx 2019
Training and custom documentation solutions help maximize effectiveness of CAD and PLM software implementations.

The New Age of GPU-Driven Product Design
Software companies are finding ways to accelerate CAD with GPUs beyond graphics and rendering.

SPEE3D Supersonic 3D Printing Design Challenge Kicks Off at RAPID + TCT 2019
Entries open at RAPID + TCT 2019 on May 20, 2019 and will be accepted until June 30, 2019.

Siemens Introduces Validation Program to Accelerate Autonomous Vehicle Development
Siemens' PAVE360 provides a comprehensive environment for multi-supplier collaboration across the automotive ecosystem for the development of next-generation automotive chips, according to the company.

AeroDef 2019: Security and Collaboration Challenges in the Era of Shifting Geopolitics
At the aerospace and defense manufacturing show, attendees and panelists discuss transparency, collaboration challenges due to geopolitical changes, and opportunities in digital twins.

Digital Twins and Cyberphysical Security at AeroDef
DE Video News May 3, 2019: Digital twins and cyberphysical security discussions at AeroDef Conf, ANSYS acuires EDA firm

Self-Driving Cars are Leveling Up in Autonomy
A look at the self-driving carmakers' road ahead.



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